XCZU9EG-2FFVB1156I
Specifications
Category:
Integrated Circuits (ICs)
Embedded
System On Chip (SoC)
Base Product Number:
XCZU9
Product Status:
Active
Peripherals:
DMA, WDT
Primary Attributes:
Zynq®UltraScale+™ FPGA, 599K+ Logic Cells
Series:
Zynq® UltraScale+™ MPSoC EG
Package:
Tray
Mfr:
AMD
Supplier Device Package:
1156-FCBGA (35x35)
Connectivity:
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Operating Temperature:
-40°C ~ 100°C (TJ)
Architecture:
MCU, FPGA
Package / Case:
1156-BBGA, FCBGA
Number Of I/O:
328
RAM Size:
256KB
Speed:
533MHz, 600MHz, 1.3GHz
Core Processor:
Quad ARM® Cortex®-A53 MPCore™ With CoreSight™, Dual ARM®Cortex™-R5 With CoreSight™, ARM Mali™-400 MP2
Flash Size:
-
Introduction
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 System On Chip (SOC) IC Zynq® UltraScale+™ MPSoC EG Zynq®UltraScale+™ FPGA, 599K+ Logic Cells 533MHz, 600MHz, 1.3GHz 1156-FCBGA (35x35)
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XCVP1502-2LLEVSVA3340 |
IC VERSAL PREM ACAP FPGA 3340BGA
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||
XCVE1752-1LSEVSVA2197 |
IC VERSAL AI-EDGE FPGA 2197BGA
|
||
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XCVP1502-2LSEVSVA3340 |
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|
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